Sep 20, 2022, 01:14 EST
Shibuya-ku, Tokyo, Japan, Japan, Sep 20, 2022, 01:14 /Comserve / -- The major players in the high temperature adhesives market are 3M Company (U.S.), Dow Corning (U.S.), Cyberbond LLC (U.S.), Three Bond Co. Ltd. (Japan), Master Bond Inc. (U.S.), and Cotronics Corporation (U.S.).
The High Temperature Adhesives Market size in terms of value is projected to grow at a CAGR of 4.6% between 2022 and 2031 to reach $4.02 billion by 2031. Asia-Pacific held the largest share in high temperature adhesives market in 2022. Major growth in the Asia-Pacific region is expected from the growing automotive and electronics application.
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The high temperature adhesives market in Asia-Pacific region is growing fast as the application industries such as automotive, electrical & electronics, aerospace and marine is expected to register a significant growth rate in last few years helping the high temperature adhesives market to grow at a remarkable pace. Presence of emerging economies such as India and China are helping the high temperature adhesives market to grow in the region.
New product launch was the key strategy adopted by industry players in order to maintain growth in the high temperature adhesives market. The high temperature adhesives has wide industrial applications and new product launches are paving the way for fulfilling the ever changing demand for new applications with higher temperature range. As a result of this, a diverse application base is developing for high temperature adhesives. Market players are focusing on launching new and innovative materials in both existing and emerging markets that can withstand high temperature range (above 150˚C).
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The major players in the high temperature adhesives market are 3M Company (U.S.), Dow Corning (U.S.), Cyberbond LLC (U.S.), Three Bond Co. Ltd. (Japan), Master Bond Inc. (U.S.), Henkel AG (Germany), Delo Industrial Adhesives LLC (U.S.), Permabond LLC. (U.S.), and Cotronics Corporation (U.S.).
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